Wire Bonder - Fully Automatic Wire Bond
Achieve high productivity with UPH25000!
Wire bond for discrete and small pin applications that meets the demands for diverse packaging and fine pad pitch.
- Company:カイジョー ODM事業部
- Price:Other
1~2 item / All 2 items
Achieve high productivity with UPH25000!
Wire bond for discrete and small pin applications that meets the demands for diverse packaging and fine pad pitch.
Over 9,000 units delivered worldwide! Bonding is possible with just a click of the mouse. Compact and effective for research and development as well as small-scale production.
The "Manual Wire Bonder iBond5000 Series" is a successor to the "4500 Series," which boasts over 400 units delivered domestically. (The 5000 Series has over 9,000 units delivered worldwide.) Bonding can be easily performed with just a click of the mouse. Its compact size makes it suitable for research and development as well as small-scale production. You can choose from three models: "for Ball Bonding," "for Wedge Bonding," and "for Both Ball and Wedge Bonding." 【Features】 ■ Equipped with a user-friendly touch panel ■ Y-axis table motion settings can be configured with parameters, making bonding of pitch wires and parallel wires easy ■ Ergonomically designed ■ ESD coating is standard *For more details, please refer to the materials. Feel free to contact us with any inquiries.